Description
DESCRIPTION Strong, highly conductive epoxy for solderless connections and repairs of circuit boards, static discharge shielding, grounding and conductive paths. Cure Schedule (Minimum bond temperature/time) 65 to 121°C (150 to 250°F) for 5 to 10 min. 25°C (75°F) for 4 hours General Properties Bonding surface mount components
High strength conductive bonds
Quick, low or no heat cure – air dries
Rework or remove with hot soldering iron
Excellent electrical conductivity
2-part epoxy, reusable applicator with stir stick, 7g each
Service temperature range -91°C to 100°C (-132°F to 212°F) permanent bond. 0.4 ohms/sq/mil (25µm) Technical Notes, Silver Conductive Epoxy(40KB PDF) 16043 SDS Part A (119KB PDF) I – 16043 SDS Part B (122KB PDF) Conductive Adhesives Comparison Table HAZARD WARNING GUIDES Cg
Suspected Carcinogen C Corrosive F Flammable I
Irritant L
Lachrymator O
Oxidizing R Radioactive S
Sensitizer T
Toxic U
Unlisted as hazard; unknown hazard if any
